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    Special Issue on InterPACK 2019 – Part 1 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003:;page 030301-1
    Author(s): Narumanchi, Sreekant; Choi, Sukwon; Karajgikar, Saket; Sun, Haiding; Zhang, Guangsheng
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We hope that you find the content of the Special Issues useful and wish you the very best.The two-part 2019 InterPACK Special Issues of the ASME Journal of Electronic Packaging (JEP) was developed from manuscripts submitted ...
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    Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003:;page 031115-1
    Author(s): Jia, Hongfeng; Yu, Huabin; Ren, Zhongjie; Xing, Chong; Liu, Zhongling; Kang, Yang; Sun, Haiding
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An aluminum-rich AlGaN layer is commonly implemented to act as an electron-blocking layer (EBL) to block electron overflow from the active region in the conventional deep-ultraviolet light-emitting diodes (DUV LEDs). Herein, ...
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian