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    Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 002:;page 20907
    Author(s): Subramanya Sadasiva; Lei Jiang; Daniel Pantuso; Ganesh Subbarayan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Understanding the effect of high current density on void formation and growth and relating the size of the void to the resulting electrical/mechanical failure is a critical need at the present ...
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