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RISComparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this work, we develop and evaluate algorithms for generating ultrapacked microstructures of particles. Simulated microstructures reported in the literature rarely contain particle volume fractions greater than 60%. ...
Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Particulate thermal interface materials (TIMs) are commonly used to transport heat from chip to heat sink. While high thermal conductance is achieved by large volume loadings of highly conducting particles in a compliant ...
Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder joints in electronic assemblies experience damage due to cyclic thermomechanical loading that eventually leads to fatigue fracture and electrical failure. While solder joints in smaller, die-sized area-array packages ...
A Noncontact Method for Estimating Thin Metal Film Adhesion Strength Through Current-Induced Void Growth
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Studies have reported that the electromigration-induced void growth velocity in metal thin films is inversely related to the adhesion strength of the metal thin film with the base and passivation layers. It was also observed ...