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    Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 001:;page 11008
    Author(s): Stafford, Jason; Fortune, Florian
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper investigates the thermal and fluid dynamic characteristics due to multiple miniature axial fans with blade chord and span length scales less than 10 mm, impinging air onto finned surfaces. A coupled approach, ...
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    A Compact Modeling Approach to Enhance Collaborative Design of Thermal Fluid Systems 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 001:;page 11004
    Author(s): Stafford, Jason; Newport, David; Grimes, Ronan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents an approach for reducing detailed numerical models of electronic equipment into compact thermalfluid models. These compact models have been created using network analogies representing mass, momentum ...
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    Finless Heat Sinks, High Performance and Low Cost for Low Profile Cooling Applications 

    Source: Journal of Thermal Science and Engineering Applications:;2013:;volume( 005 ):;issue: 003:;page 31001
    Author(s): Walsh, Ed; Grimes, Ronan; Walsh, Patrick; Stafford, Jason
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The need for low profile, sustainable thermal management solutions is becoming critical in information and communications technology applications ranging from consumer products to server cabinets. This work presents a ...
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    Passive Control and Enhancement of Low Reynolds Number Slot Jets Through the Use of Tabs and Chevrons 

    Source: Journal of Heat Transfer:;2018:;volume( 140 ):;issue: 003:;page 32201
    Author(s): Sexton, Andrew; Punch, Jeff; Stafford, Jason; Jeffers, Nicholas
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Liquid microjets are emerging as candidate primary or secondary heat exchangers for the thermal management of next generation photonic integrated circuits (PICs). However, the thermal and hydrodynamic behavior of confined, ...
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