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    Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41101-1
    Author(s): Gharaibeh, Ahmad R.; Soud, Qusai; Manaserh, Yaman; Tradat, Mohammad; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The variety of new electronic packaging technologies has grown significantly over the last 20 years as a result of market demands for higher device performance at lower costs and in less space. Those demands have pushed ...
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    Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41102-1
    Author(s): Heydari, Ali; Gharaibeh, Ahmad R.; Tradat, Mohammad; Soud, Qusai; Manaserh, Yaman; Radmard, Vahideh; Eslami, Bahareh; Rodriguez, Jeremy; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The ability of traditional room-conditioning systems to accommodate expanding information technology loads is limited in contemporary data centers (DCs), where the storage, storing, and processing of data have grown quickly ...
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    Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41106-1
    Author(s): Heydari, Ali; Soud, Qusai; Tradat, Mohammad; Gharaibeh, Ahmad R.; Fallahtafti, Najmeh; Rodriguez, Jeremy; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As web-based AI applications are growing rapidly, server rooms face escalating computational demands, prompting enterprises to either upgrade their facilities or outsource to co-located sites. This growth strains conventional ...
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    DSpace software copyright © 2002-2015  DuraSpace
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