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    Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 21117-1
    Author(s): Lall, Pradeep; Narangaparambil, Jinesh; Soni, Ved; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Flexible electronics is emerging as a new consumer-industry phenomenon. The promise of additively printed flexible electronics has sparked interest in a detailed understanding of the parameters and interactions of the ...
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    Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 002:;page 21112-1
    Author(s): Lall, Pradeep; Soni, Ved; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The demand for wearable consumer electronics, fitness accessories, and biomedical equipment has led to the growth research and development of thin flexible batteries. Wearable equipment and other asset monitoring applications ...
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