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RISComparison of Ball Pull Strength Among Various Sn Cu Ni Solder Joints With Different Pad Surface Finishes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: SnCuNi is one of the most common ternary intermetallic compounds formed in the Snbased solder joint, and its formation and properties can be greatly influenced by the amount of Ni. Ni can participate in the interfacial ...