Search
Now showing items 1-1 of 1
Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The high current densities in today's microelectronic devices and microchips lead to hotspot formations and other adverse effects on their performance. Therefore, a computational tool is needed to not only analyze but also ...
CSV
RIS