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    Compressive Experimental Analysis and Constitutive Model of Sintered NanoSilver 

    Source: Journal of Applied Mechanics:;2022:;volume( 090 ):;issue: 003:;page 31004
    Author(s): He, Gong;Tongyang, Wang;Jianqun, Zhu;Shujin, Li;Yao, Yao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Aiming at the potential hightemperature packaging material of the wide band gap semiconductors, experimental and theoretical analysis on the compressive properties of sintered nanosilver was performed. The viscoplastic ...
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    Compressive Experimental Analysis and Constitutive Model of Sintered Nano-Silver 

    Source: Journal of Applied Mechanics:;2022:;volume( 090 ):;issue: 003:;page 31004-1
    Author(s): He, Gong; Tongyang, Wang; Jianqun, Zhu; Shujin, Li; Yao, Yao
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Aiming at the potential high-temperature packaging material of the wide band gap semiconductors, experimental and theoretical analysis on the compressive properties of sintered nano-silver was performed. The viscoplastic ...
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