YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-2 of 2

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Corrosion Study on Single-Phase Liquid Cooling Cold Plates With Inhibited Propylene Glycol/Water Coolant for Data Centers 

    Source: Journal of Manufacturing Science and Engineering:;2021:;volume( 143 ):;issue: 011:;page 0111012-1
    Author(s): Shia, David; Yang, Jin; Sivapalan, Sean; Soeung, Rithi; Amoah-Kusi, Christian
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Single-phase cold plate liquid cooling attracts more and more attention to high-performance computing (HPC), cloud computing, and general computing data centers for the thermal management of modern microprocessors and ...
    Request PDF

    Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies 

    Source: Journal of Electronic Packaging:;2021:;volume( 143 ):;issue: 004:;page 041108-1
    Author(s): Chuang, Jimmy; Yang, Jin; Shia, David; Li, Y. L.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In order to meet the increasing performance demand of high-performance computing and edge computing, thermal design power (TDP) of central processing unit (CPU) and graphics processing unit (GPU) needs to increase. This ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian