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    Transferring Manipulative Skills to Robots: Representation and Acquisition of Tool Manipulative Skills Using a Process Dynamics Model 

    Source: Journal of Dynamic Systems, Measurement, and Control:;1992:;volume( 114 ):;issue: 002:;page 220
    Author(s): Sheng Liu; Haruhiko Asada
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A new method based on task process models for acquiring manipulative skills from human experts is presented. In performing manipulative tasks such as deburring, a human expert moves a tool at ...
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    Studies on a Large-Span Beam String Pipeline Crossing 

    Source: Journal of Structural Engineering:;2008:;Volume ( 134 ):;issue: 010
    Author(s): Weichen Xue; Sheng Liu
    Publisher: American Society of Civil Engineers
    Abstract: Beam string pipeline crossing (BSP) is a new type of a self-supporting, large-span pipeline crossing structure. Based on the ANSYS program, the prestressing force of a
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    Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 001:;page 39
    Author(s): Sheng Liu; I. Charles Ume
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Digital signal processing methods in a novel flip chip solder joint quality inspection system are presented. Laser ultrasound and interferometric system is a new approach for solder joint ...
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    Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection 

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003:;page 221
    Author(s): Sheng Liu; I. Charles Ume
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A novel approach for flip-chip solder joint quality inspection based on vibration analysis is presented. Traditional solder joint inspection methods have their limitations when applied to flip ...
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    A Singular Perturbation Approach for Modeling Differential-Algebraic Systems 

    Source: Journal of Dynamic Systems, Measurement, and Control:;1998:;volume( 120 ):;issue: 004:;page 541
    Author(s): Brandon W. Gordon; Sheng Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Dynamic systems described by an implicit mixed set of Differential and Algebraic Equations (DAEs) are often encountered in control system modeling and analysis due to inherent constraints in the ...
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    Decadal Variability in the North Pacific and North Atlantic under Global Warming: The Weakening Response and Its Mechanism 

    Source: Journal of Climate:;2020:;volume( 33 ):;issue: 021:;page 9181
    Author(s): Wu, Sheng;Liu, Zheng-Yu
    Publisher: American Meteorological Society
    Abstract: We investigate the response of decadal variability in the North Pacific and North Atlantic under global warming and its mechanism in this study. To do so, we use four models (BCC-CSM1–1, CCSM4, IPSL-CM5A-LR, and MPI-ESM-LR) ...
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    Modeling of Vapor Compression Cycles for Multivariable Feedback Control of HVAC Systems 

    Source: Journal of Dynamic Systems, Measurement, and Control:;1997:;volume( 119 ):;issue: 002:;page 183
    Author(s): Xiang-Dong He; Sheng Liu; Haruhiko H. Asada
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents a new lumped-parameter model for describing the dynamics of vapor compression cycles. In particular, the dynamics associated with the two heat exchangers, i.e., the evaporator ...
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    Measurement of Leak Rate for MEMS Vacuum Packaging 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 004:;page 41001
    Author(s): Zhiyin Gan; Dexiu Huang; Xuefang Wang; Sheng Liu; Dong Lin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Many Micro-Electro-Mechanical Systems (MEMS) devices such as accelerators, gyroscopes, uncooled infrared sensors, etc., require vacuum packaging. The vacuum maintaining lifetime directly determines ...
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    A Novel Ceramic Packaging Technique Using Selective Induction Heating 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 004:;page 41010
    Author(s): Sheng Liu; Wenming Liu; Changyong Lin; Mingxiang Chen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A novel ceramic packaging technology by using selective induction heating is presented. Some aspects of this packaging process, including local temperature distribution, hermeticity, tensile strength, ...
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    Optimization of Turbine Disk Profiles by Metamorphic Development 

    Source: Journal of Mechanical Design:;2002:;volume( 124 ):;issue: 002:;page 192
    Author(s): Jing-Sheng Liu; Geoffrey T. Parks; P. John Clarkson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A novel topology/shape optimization method, Metamorphic Development, is applied to an axisymmetric thermo-elasticity design problem. Based on solid modeling and finite element analysis, optimal ...
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