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    Thermal Performance of a Water Cooled Microchannel Heat Sink With Grooves and Obstacles 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 002:;page 21001
    Author(s): Xie, Yonghui; Shen, Zhongyang; Zhang, Di; Lan, Jibing
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: With the rapid development of microelectromechanical systems (MEMS) in IT industry, the heat flux in microchannel has reached a high level which demands preferable cooling technology. Water cooling has become a favor cooling ...
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    Numerical Analysis of Flow Structure and Heat Transfer Characteristics in Dimpled Channels With Secondary Protrusions 

    Source: Journal of Heat Transfer:;2016:;volume( 138 ):;issue: 003:;page 31901
    Author(s): Xie, Yonghui; Shen, Zhongyang; Zhang, Di; Ligrani, Phillip
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Dimple structure is an effective heat transfer augmentation approach on coolant channel due to its advantage on pressure penalty. The implication of secondary protrusion, which indicates protrusion with smaller dimension ...
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    Thermal Performance of Miniscale Heat Sink With Jet Impingement and Dimple/Protrusion Structure 

    Source: Journal of Heat Transfer:;2017:;volume( 139 ):;issue: 005:;page 52202
    Author(s): Shen, Zhongyang; Jing, Qi; Xie, Yonghui; Zhang, Di
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Cooling technique in a miniscale heat sink is essential with the development of high-power electronics, such as electronic chip. As heat transfer techniques, jet impingement cooling and convective cooling by roughened ...
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    Thermal Performance of Miniscale Heat Sink With Jet Impingement and Dimple/Protrusion Structure 

    Source: Journal of Heat Transfer:;2017:;volume( 139 ):;issue: 005:;page 52202
    Author(s): Shen, Zhongyang; Jing, Qi; Xie, Yonghui; Zhang, Di
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Cooling technique in a miniscale heat sink is essential with the development of high-power electronics, such as electronic chip. As heat transfer techniques, jet impingement cooling and convective cooling by roughened ...
    Request PDF
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