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    Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks? 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 003:;page 308
    Author(s): Shankar Krishnan; Suresh V. Garimella
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper ...
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    Simulation of Thermal Transport in Open-Cell Metal Foams: Effect of Periodic Unit-Cell Structure 

    Source: Journal of Heat Transfer:;2008:;volume( 130 ):;issue: 002:;page 24503
    Author(s): Shankar Krishnan; Suresh V. Garimella; Jayathi Y. Murthy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Direct simulation of thermal transport in open-cell metal foams is conducted using different periodic unit-cell geometries. The periodic unit-cell structures are constructed by assuming the pore ...
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