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Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper ...
Simulation of Thermal Transport in Open-Cell Metal Foams: Effect of Periodic Unit-Cell Structure
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Direct simulation of thermal transport in open-cell metal foams is conducted using different periodic unit-cell geometries. The periodic unit-cell structures are constructed by assuming the pore ...