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    Single Phase Liquid Cooling of High Heat Flux Devices With Local Hotspot in a Microgap With Nonuniform Fin Array 

    Source: Journal of Heat Transfer:;2021:;volume( 143 ):;issue: 003:;page 031501-1
    Author(s): Hu, Yuanchen; Sarvey, Thomas; Bakir, Muhannad S.; Joshi, Yogendra
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Single-phase liquid cooling in microchannels and microgaps has been successfully demonstrated for heat fluxes of ∼1 kW/cm2 for silicon chips with maximum temperature below 100 °C. However, effectively managing localized ...
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    A Review of Two Phase Forced Cooling in Three Dimensional Stacked Electronics: Technology Integration 

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004:;page 40802
    Author(s): Green, Craig; Kottke, Peter; Han, Xuefei; Woodrum, Casey; Sarvey, Thomas; Asrar, Pouya; Zhang, Xuchen; Joshi, Yogendra; Fedorov, Andrei; Sitaraman, Suresh; Bakir, Muhannad
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Threedimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking ...
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    Three Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications 

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001:;page 10910
    Author(s): Zhang, Xuchen; Han, Xuefei; Sarvey, Thomas E.; Green, Craig E.; Kottke, Peter A.; Fedorov, Andrei G.; Joshi, Yogendra; Bakir, Muhannad S.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper reports on novel thermal testbeds with embedded micropinfin heat sinks that were designed and microfabricated in silicon. Two micropinfin arrays were presented, each with a nominal pin height of 200 خ¼m and ...
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    Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps 

    Source: Journal of Electronic Packaging:;2017:;volume( 139 ):;issue: 001:;page 11006
    Author(s): Nasr, Mohamed H.; Green, Craig E.; Kottke, Peter A.; Zhang, Xuchen; Sarvey, Thomas E.; Joshi, Yogendra K.; Bakir, Muhannad S.; Fedorov, Andrei G.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: As integration levels increase in next generation electronics, high power density devices become more susceptible to hotspot formation, which often imposes a thermal limitation on performance. Flow boiling of R134a in two ...
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