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    Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002:;page 24502
    Author(s): Samson Yoon; Changsoo Jang; Bongtae Han
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A nonlinear finite element modeling (FEM) scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion, heat ...
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    On Moisture Diffusion Modeling Using Thermal-Moisture Analogy 

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004:;page 421
    Author(s): Samson Yoon; Zhaoyang Wang; Bongtae Han
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) ...
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    Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 001:;page 11004
    Author(s): Changsoo Jang; Bongtae Han; Samson Yoon; Seungbae Park
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing analogy schemes. The new scheme is based on the experimentally observed unique ...
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