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Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A nonlinear finite element modeling (FEM) scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion, heat ...
On Moisture Diffusion Modeling Using Thermal-Moisture Analogy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) ...
Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing analogy schemes. The new scheme is based on the experimentally observed unique ...
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