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Transient Characterization of Hybrid Microfluidic Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power dissipated by modern microprocessors is a function of time and continuously changes with the workload, giving rise to temporal hotspots of local areas with very high power dissipation. A hybrid cooling scheme has ...
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