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RISCombined Microstructure and Heat Conduction Modeling of Heterogeneous Interfaces and Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Heterogeneous materials are becoming more common in a wide range of functional devices, particularly those involving energy transport, conversion, and storage. Often, heterogeneous materials are crucial to the performance ...
Combined Microstructure and Heat Transfer Modeling of Carbon Nanotube Thermal Interface Materials1
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A microstructuresensitive thermomechanical simulation framework is developed to predict the mechanical and heat transfer properties of vertically aligned CNT (VACNT) arrays used as thermal interface materials (TIMs). The ...