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    Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 002:;page 186
    Author(s): Y. Guo; S. Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The mechanical analysis of electronic packaging has significant impact on the system reliability of an electronic device, and, therefore, is critical in packaging design and manufacturing. The ...
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    Computational Isotropic-Workhardening Rate-Independent Elastoplasticity 

    Source: Journal of Applied Mechanics:;2003:;volume( 070 ):;issue: 005:;page 644
    Author(s): S. Mukherjee; C.-S. Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A novel formulation for elastoplasticity has been recently proposed by Liu and Hong. These authors have explored the internal symmetry of the constitutive model for perfect plasticity to ensure ...
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    Basic LOgical Bulk Shapes (BLOBs) for Finite Element Hexahedral Mesh Generation to Support Virtual Prototyping 

    Source: Journal of Manufacturing Science and Engineering:;1998:;volume( 120 ):;issue: 004:;page 728
    Author(s): S.-S. Liu; R. Gadh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Manufacturability analysis of product design reduces the downstream problems of manufacturing. Such design approaches are referred to as Virtual Prototyping when performed on the computer. In the ...
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    An Analysis of a Pneumatic Servo System and Its Application to a Computer-Controlled Robot 

    Source: Journal of Dynamic Systems, Measurement, and Control:;1988:;volume( 110 ):;issue: 003:;page 228
    Author(s): S. Liu; J. E. Bobrow
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Pneumatic actuators are capable of providing high power output levels at a relatively low cost. In addition, they are clean, lightweight, and can be easily serviced. The difficulty of achieving ...
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    Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 003:;page 309
    Author(s): J. Wang; Z. Qian; S. Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, a nonlinear finite element framework was established for processing mechanics modeling of flip-chip packaging assemblies and relevant layered manufacturing. In particular, topological ...
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    Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 002:;page 145
    Author(s): Z. Qian; M. Lu; S. Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A unified constitutive model for polymer films is proposed with viscoelastic characterization at small deformation and viscoplastic characterization at large deformation based on molecular chain ...
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    Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package 

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 002:;page 160
    Author(s): J. Zhu; D. Zou; S. Liu
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermally-induced failure is a major reliability issue for electronic packaging. Due to the highly nonlinear behaviors and thermal mismatch of packaging materials, an electronic package exhibits ...
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    Forced Vibration of Flexible Body Systems: A Dynamic Stiffness Method 

    Source: Journal of Vibration and Acoustics:;1993:;volume( 115 ):;issue: 004:;page 468
    Author(s): T. S. Liu; J. C. Lin
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Due to the development of high speed machinery, robots, and aerospace structures, the research of flexible body systems undergoing both gross motion and elastic deformation has seen increasing ...
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    A Similarity Method for Miniature Mobile Robots 

    Source: Journal of Dynamic Systems, Measurement, and Control:;1998:;volume( 120 ):;issue: 001:;page 15
    Author(s): T. S. Liu; J. Y. Lee
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Taking advantage of a piezoelectric material to fabricate miniature mobile robots, this study presents a similarity method, fabrication process, and walking experiment method. A curved piezoelectric ...
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    A Repetitive Learning Method Based on Sliding Mode for Robot Control 

    Source: Journal of Dynamic Systems, Measurement, and Control:;2000:;volume( 122 ):;issue: 001:;page 40
    Author(s): T. S. Liu; W. S. Lee
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In order to make a robot precisely track desired periodic trajectories, this work proposes a sliding mode based repetitive learning control method, which incorporates characteristics of sliding ...
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