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RISThe Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, the diffusion behavior and microstructural evolution of Cu-Sn intermetallics at eutectic Sn-Pb solder/copper substrate interface of PBGA solder joints was studied. The PBGA solder ...
Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The shear cycle fatigue lifetimes of plastic ball grid array (PBGA) solder joints formed using different reflow profiles are studied in this paper. The profiles were devised to have the same ...