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    A Bonded Joint Analysis for Surface Mount Components 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001:;page 1
    Author(s): S. E. Yamada
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: To gain a better understanding of the stress state in surface mount joints and their design considerations, an analysis method of bonded joints is developed and consequently three parameters ...
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    Analysis of Insertion Force in Elastic/Plastic Mating 

    Source: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003:;page 192
    Author(s): S. E. Yamada; H. Ueno
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A simulation of an insertion of a solid pin into a slot between two opposing compliant beams is attempted. As a particular feature, the elastic-plastic deformation of the slot during the ...
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    On Plastic Strain in Porous Materials 

    Source: Journal of Applied Mechanics:;1981:;volume( 048 ):;issue: 004:;page 976
    Author(s): M. M. Carroll; J. F. Schatz; S. E. Yamada
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The formulation of continuum theories for inelastic response usually involves the definition of plastic strains or plastic strain increments. For solid materials, these are usually defined in ...
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