Abstract: This paper experimentally examines the influence of coating thickness, test temperature, coating hardness, and defects on the erosion resistance of boride coatings, ion plating CrN coatings, and ...

Abstract: FeNi alloy is considered a possible substitute for Cu as under bump metallization (UBM) in wafer level package (WLP) since it forms very thin intermetallic compound (IMC) layer with Pbfree solder in the reflow process. In ...