Abstract: Ohmic curing was utilized as a method to improve the conductivity of threedimensional (3D) interconnects printed from silverloaded conductive inks and pastes. The goal was to increase conductivity of the conductive path ...

Abstract: The objective of this work is to identify failure modes and detect the onset of process anomalies in additive manufacturing (AM) processes, specifically focusing on fused filament fabrication (FFF). We accomplish this ...