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RISAssessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Repeated loading is an important reason to cause pad cratering fatigue failure in ball grid array (BGA) device in printed circuit board (PCB) assembly. For industry application, the board level drop test is commonly applied ...
Comparison of Ball Pull Strength Among Various Sn Cu Ni Solder Joints With Different Pad Surface Finishes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: SnCuNi is one of the most common ternary intermetallic compounds formed in the Snbased solder joint, and its formation and properties can be greatly influenced by the amount of Ni. Ni can participate in the interfacial ...
Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Cu pillar microbumps with polymer cores have been demonstrated to effectively reduce thermomechanical stress and improve joint reliability. Fabricating polymer cores by a printing approach was proposed to overcome the ...
Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In recent years, due to the increased size of ball grid array (BGA) devices, the assembly of BGAs on printed circuit boards through surface mount technology has encountered unprecedented challenges from thermal warpage. ...