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    Thermal Response of Multi Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization 

    Source: Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 003:;page 31004
    Author(s): Huang, Houxue; Borhani, Navid; Richard Thome, John
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Multimicrochannel evaporators with flow boiling, used for cooling high heat flux devices, usually experience transient heat loads in practical applications. These transient processes may cause failure of devices due to a ...
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    Two Phase Flow Control of Electronics Cooling With Pseudo CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation 

    Source: Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 003:;page 30908
    Author(s): Lamaison, Nicolas; Braz Marcinichen, Jackson; Richard Thome, John
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Onchip twophase cooling of parallel pseudoCPUs integrated into a liquid pumped cooling cycle is modeled and experimentally verified versus a prototype test loop. The system's dynamic operation is studied since the heat ...
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    Modeling of Two Phase Evaporative Heat Transfer in Three Dimensional Multicavity High Performance Microprocessor Chip Stacks 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 002:;page 21006
    Author(s): Madhour, Yassir; d'Entremont, Brian P.; Braz Marcinichen, Jackson; Michel, Bruno; Richard Thome, John
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Threedimensional (3D) stacking of integratedcircuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with areaarray throughsiliconvias (TSVs). This reduces the length ...
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