Abstract: Wiresaw has emerged as a leading technology in wafer preparation for microelectronics fabrication, especially in slicing large silicon wafers (diameter≥300 mm) for both microelectronic and photovoltaic ...

Abstract: This study presents an analysis of warping that occurs in the laminated object manufacturing process. Based on the study of thermal-mechanical behavior of the adhesive and its effect on the ...

Abstract: Current brain deformation models have predominantly reflected solid constitutive relationships generated from empirical ex vivo data and have largely overlooked interstitial hydrodynamic effects. In ...

Abstract: In the abdominal segment of the human aorta under a patient’s average resting conditions, pulsatile blood flow exhibits complex laminar patterns with secondary flows induced by adjacent branches ...