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    Enhanced Cooling of Electronic Components Using Fluid Flow Under High Adverse Pressure Gradient 

    Source: Journal of Thermal Science and Engineering Applications:;2015:;volume( 007 ):;issue: 003:;page 31011
    Author(s): Ravishankar, S.; Arul Prakash, K.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Heat transfer in electronic systems is studied by simulating flow in a two pass channel with the divider representing a circuit board. Bypass holes are introduced on the circuit board to obtain detailed physical insights ...
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