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RISAn Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A solder joint specimen has been designed to determine the stress/strain hysteresis response and fracture behavior of 90 percent wtPb/10 percent wtSn solder alloy. The specimen consists of an ...
Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Failures in electronic packages under thermal fatigue usually result from cracking in solder joints due to creep/fatigue crack growth. Understanding the stress/strain behavior of such solder joints ...