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    A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 004:;page 41015-1
    Author(s): Mohsenian, Ghazal; Hoang, Cong Hiep; Nemati, Kourosh; Alissa, Hussam; Tradat, Mohammad; Fallahtafti, Najmeh; Radmard, Vahideh; Murray, Bruce; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types ...
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    Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41117-1
    Author(s): Shahi, Pardeep; Heydari, Ali; Eslami, Bahareh; Radmard, Vahideh; Hinge, Chandraprakash; Modi, Himanshu; Chinthaparthy, Lochan Sai Reddy; Tradat, Mohammad; Agonafer, Dereje; Rodriguez, Jeremy
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented ...
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    Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41102-1
    Author(s): Heydari, Ali; Gharaibeh, Ahmad R.; Tradat, Mohammad; Soud, Qusai; Manaserh, Yaman; Radmard, Vahideh; Eslami, Bahareh; Rodriguez, Jeremy; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The ability of traditional room-conditioning systems to accommodate expanding information technology loads is limited in contemporary data centers (DCs), where the storage, storing, and processing of data have grown quickly ...
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    Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks 

    Source: Journal of Electronic Packaging:;2020:;volume( 143 ):;issue: 002:;page 021007-1
    Author(s): Hadad, Yaser; Radmard, Vahideh; Rangarajan, Srikanth; Farahikia, Mahdi; Refai-Ahmed, Gamal; Chiarot, Paul R.; Sammakia, Bahgat
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The industry shift to multicore microprocessor architecture will likely cause higher temperature nonuniformity on chip surfaces, exacerbating the problem of chip reliability and lifespan. While advanced cooling technologies ...
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    DSpace software copyright © 2002-2015  DuraSpace
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