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A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types ...
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Demand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented ...
Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ability of traditional room-conditioning systems to accommodate expanding information technology loads is limited in contemporary data centers (DCs), where the storage, storing, and processing of data have grown quickly ...
Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The industry shift to multicore microprocessor architecture will likely cause higher temperature nonuniformity on chip surfaces, exacerbating the problem of chip reliability and lifespan. While advanced cooling technologies ...