YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    Search 
    •   YE&T Library
    • Search
    •   YE&T Library
    • Search
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Search

    Show Advanced FiltersHide Advanced Filters

    Filters

    Use filters to refine the search results.

    Now showing items 1-3 of 3

    • Relevance
    • Title Asc
    • Title Desc
    • Year Asc
    • Year Desc
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100
  • Export
    • CSV
    • RIS
    • Sort Options:
    • Relevance
    • Title Asc
    • Title Desc
    • Issue Date Asc
    • Issue Date Desc
    • Results Per Page:
    • 5
    • 10
    • 20
    • 40
    • 60
    • 80
    • 100

    Transient Performance Analysis of Centrifugal Left Ventricular Assist Devices Coupled With Windkessel Model: Large Eddy Simulations Study on Continuous and Pulsatile Flow Operation 

    Source: Journal of Biomechanical Engineering:;2024:;volume( 146 ):;issue: 010:;page 101008-1
    Author(s): Gil, Antonio; Navarro, Roberto; Quintero, Pedro; Mares, Andrea
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Computational fluid dynamics (CFD) simulations are widely used to develop and analyze blood-contacting medical devices such as left ventricular assist devices (LVADs). This work presents an analysis of the transient behavior ...
    Request PDF

    Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics 

    Source: Journal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004:;page 41107-1
    Author(s): Guerrero-Fernandez, Margie; Quintero, Pedro; Ozdemir, Ozan Cagatay
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study investigates the use of cold gas spraying (CGS) as a low-temperature additive manufacturing method to bond copper onto aluminum nitride (AlN) substrates for electronic packaging of high-power applications. While ...
    Request PDF

    Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles 

    Source: Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003
    Author(s): Báez, Rafael; González, Luis E.; de Jesús-López, Manny X.; Quintero, Pedro O.; Boteler, Lauren M.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Metallic phase change materials (mPCMs) have been demonstrated as potential passive cooling solution for pulse power applications. The possibility of integrating a metallic PCM directly on top of a heat source, reducing ...
    Request PDF
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     

    Author

    ... View More

    Publisher

    Year

    Type

    Content Type

    Publication Title

    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian