Abstract: With the increase in power consumption in compact electronic devices, passive heat transfer cooling technologies with high-heat-flux characteristics are highly desired in microelectronic industries. ...

Abstract: Dryout in a heat pipe evaporator is caused by insufficient condensate supply through the wick structure. Dryout is generally considered a failure of the heat pipe operation. However, traditional ...

Abstract: A silicon heat spreader, called hexcell, is presented to develop thin, strong, interconnected, and scalable heat transfer devices for high power electronics cooling. Several key technical aspects, ...