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    Microstructural Modeling for Elastic Moduli of Bonded Granules 

    Source: Journal of Engineering Mechanics:;1999:;Volume ( 125 ):;issue: 006
    Author(s): Ching S. Chang; Qing S. Shi; Han Zhu
    Publisher: American Society of Civil Engineers
    Abstract: In this paper, a microgranular mechanics approach is used to derive an expression for the elastic moduli of an assembly of bonded granulates, based on the response of two particles that are connected by an elastic binder. ...
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