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RISThermal Stresses in Layered Electronic Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal stresses in layered electronic assemblies are one of the causes of the mechanical failure of electronic packages. A simple but accurate method of estimating these thermal stresses is ...
Reduction of NOx in a Regenerative Industrial Furnace With the Addition of Methanol in the Fuel
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The analysis of the combustion process and NOx emission in a gas-fired regenerative industrial furnace has been carried out numerically. The effect of the additive, methanol (CH3OH), to the ...
Statistical Assessment of Spatial Tornado Occurrences in Canada: Modeling and Estimation
Publisher: American Meteorological Society
Ground Responses to Tunneling in Soft Soil Using the URUP Method
Publisher: American Society of Civil Engineers
Abstract: The ultrarapid underpass (URUP) tunneling method, in which a shield machine is launched and received at the ground surface level, has been developed for tunneling in congested areas. This paper reports monitoring results ...
A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A model for crack nucleation in layered electronic assemblies under thermal cycling is developed in this paper. The present model includes three scales: (i) at the microscale or the mechanism ...