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    Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 001:;page 126
    Author(s): Suman Chakraborty; Pradip Dutta
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, we develop an analytical heat transfer model, which is capable of analyzing cyclic melting and solidification processes of a phase change material used in the context of electronics ...
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