Abstract: Goldmann constants and Norris–Landzberg acceleration factors for SAC305 lead-free solders have been developed based on principal component regression models (PCR) for reliability prediction and part ...

Abstract: Leading indicators of failure have been developed based on high-frequency characteristics, and system-transfer function derived from resistance spectroscopy measurements during shock and vibration. ...

Abstract: Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased ...

Abstract: Portable electronics is subjected to extreme accelerations in shock and drop impact. Product development cycle times and the cost constraints often restrict the number of design variations tested ...

Abstract: Microprocessor packaging in modern workstations and servers often consists of one or more large flip chip die that are mounted to a high performance ceramic chip carrier. The final assembly ...

Abstract: Mechanical Design of Electronic Systems,. College House Enterprises, LLC, Knoxville, TN, 2008