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Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: There are numbers of through ceramic vias (TCVs) in ceramic package substrates for vertical interconnection of signal, and it would be very difficult, even impossible, to create the full-wave three-dimensional (3D) model ...
A Dilution-Filtration System for Removing Cryoprotective Agents
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In most cryopreservation applications, the final concentrations of cryoprotective agents (CPAs) must be reduced to biocompatible levels. However, traditional methods for removing CPAs usually have ...