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    Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate 

    Source: Journal of Electronic Packaging:;2024:;volume( 147 ):;issue: 002:;page 21004-1
    Author(s): Ren, Pan; Wang, Chulin; Liang, Yaya; Zhao, Xuan; Li, Xiaojie; Pingan, Du
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: There are numbers of through ceramic vias (TCVs) in ceramic package substrates for vertical interconnection of signal, and it would be very difficult, even impossible, to create the full-wave three-dimensional (3D) model ...
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    A Dilution-Filtration System for Removing Cryoprotective Agents 

    Source: Journal of Biomechanical Engineering:;2011:;volume( 133 ):;issue: 002:;page 21007
    Author(s): Xiaoming Zhou; Zhong Liu; Zhiquan Shu; Pingan Du; JaeHyun Chung; Carolyn Liu; Shelly Heimfeld; Dayong Gao; Weiping Ding
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In most cryopreservation applications, the final concentrations of cryoprotective agents (CPAs) must be reduced to biocompatible levels. However, traditional methods for removing CPAs usually have ...
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