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RISReliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reliability of fine pitch Sn–3.8Ag–0.7Cu flip chip solder joints with three different pads, i.e., bare pads, pads with solder masks, and pads with microvia, on printed circuit boards (PCBs) ...