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    An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling 

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003:;page 196
    Author(s): Yong Du; Jie-Hua Zhao; Paul Ho
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An optical method was developed to measure the two-dimensional (2D) surface curvatures of electronic packages by employing four laser beams. Each laser beam measures the slopes of the surface ...
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