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RISInvestigation of Variable Frequency Microwave Processing for Electronic Packaging Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper summarizes the effects of the variable frequency microwave (VFM) technique for rapid cure of polymeric encapsulants (such as flip-chip underfills) on the performance and reliability ...
Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper discusses an innovative technique for rapid cure of polymeric encapsulants such as underfills used in direct chip attach devices using variable frequency microwaves (VFM). VFM processing ...