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    Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams 

    Source: Journal of Electronic Packaging:;2021:;volume( 143 ):;issue: 003:;page 031003-1
    Author(s): Rajamuthu, Varun Prasanna; Panse, Sanskar S.; Ekkad, Srinath
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: High porosity, high pore-density (pores per inch: PPI) metal foams are a popular choice in high heat flux cooling applications as they offer large heat transfer area over a given volume, however, accompanied by a concomitant ...
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