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Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates ...
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at ...