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RISIn Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Development of the residual stresses in an organic adhesive, alumina filled epoxy (EPO-TEK H65-175MP) during curing process has been studied in-situ. The effect of the adhesive’s thickness was ...
Investigation of the Lead-On-Chip Package’s Reliability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An assembly test chip (ATC), consisting of varieties of test structures, had been utilized to monitor the package integrity of SOJ lead-on-chip (LOC) packages after various reliability tests. ...