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Investigation of Hierarchically Branched-Microchannel Coolers Fabricated by Deep Reactive Ion Etching for Electronics Cooling Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The removal of high heat fluxes from BeO ceramic and GaN-on-SiC semiconductor dies using hierarchically branched-microchannel coolers is investigated, in order to examine the impact of the number ...