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RISThe Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: To investigate the effect of stencil thickness and reflow ambient atmosphere on the reliability of ceramic ball grid array (CBGA) assemblies, three levels of stencil thickness, 0.10, 0.15, and ...
Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flip chip is the emerging interconnect technology for the next generation of high performance electronics. To eliminate the process bottlenecks associated with flip chip assembly, a new assembly ...