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    Residual Stresses for In-Situ Deposition of Thin-Film High-Temperature Superconductors 

    Source: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004:;page 249
    Author(s): P. E. Phelan; M. N. Ghasemi Nejhad
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Residual stresses are caused by nonuniform thermal expansion and chemical shrinkage taking place during processing. For thin-film high-temperature superconductors, residual stresses result because ...
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    Convective Heat Transfer for Water-Based Alumina Nanofluids in a Single 1.02-mm Tube 

    Source: Journal of Heat Transfer:;2009:;volume( 131 ):;issue: 011:;page 112401
    Author(s): W. Y. Lai; Ravi Prasher; S. Vinod; P. E. Phelan
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Nanofluids are colloidal solutions, which contain a small volume fraction of suspended submicron particles or fibers in heat transfer liquids such as water or glycol mixtures. Compared with the ...
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    Determining Thermal Conductivity of Paving Materials Using Cylindrical Sample Geometry 

    Source: Journal of Materials in Civil Engineering:;2010:;Volume ( 022 ):;issue: 002
    Author(s): J. D. Carlson; R. Bhardwaj; P. E. Phelan; K. E. Kaloush; J. S. Golden
    Publisher: American Society of Civil Engineers
    Abstract: A testing procedure was developed for determining thermal conductivity
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    Energy Efficiency of Refrigeration Systems for High-Heat-Flux Microelectronics 

    Source: Journal of Thermal Science and Engineering Applications:;2010:;volume( 002 ):;issue: 003:;page 31004
    Author(s): P. E. Phelan; J. Catano; G. Michna; Y. Gupta; H. Tyagi; R. Zhou; J. Wen; R. S. Prasher; M. Jensen; Y. Peles
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Increasingly, military and civilian applications of electronics require extremely high-heat fluxes on the order of 1000 W/cm2. Thermal management solutions for these severe operating conditions are ...
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