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Thermal Characterization of Subcooled Flow Boiling in a Pin-Fin Coldplate With Non-Uniform Heating
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Coldplates are a crucial component in various cooling applications, such as cooling data center servers and power electronics. The unprecedented growth in electronics power density, along with the resulting ultrahigh heat ...
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The next generation of integrated power electronics packages will implement wide-bandgap devices with ultrahigh device heat fluxes. Although jet impingement has received attention for power electronics thermal management, ...