Abstract: The increasing heat densities in electronic components and focus on energy efficiency have motivated utilization of embedded two-phase cooling, which reduces system-level thermal resistance and pumping power. To achieve ...

Abstract: This paper focuses on the study of an innovative manifold microchannel design for air-side heat transfer enhancement that uses additive manufacturing (AM) technology. A numerical-based multi-objective optimization was ...

Abstract: To improve the reliability and efficiency of power electronics, their thermal management must be further enhanced. Next-generation electronics systems are predicted to dissipate more heat as die size shrinks and power ...

Abstract: In this paper, we present the results of an experimental study involving low thermal resistance cooling of high heat flux power electronics in a forced convection mode, as well as in a thermosiphon (buoyancy-driven) mode. ...