Abstract: In this paper, we present the results of an experimental study involving low thermal resistance cooling of high heat flux power electronics in a forced convection mode, as well as in a thermosiphon (buoyancy-driven) mode. ...

Abstract: Dr. Kenneth John Bell, Kerr-McGee Chair Emeritus and Regents Professor Emeritus of Chemical Engineering, at Oklahoma State University, Stillwater, passed peacefully, on Monday, April 17, 2023, at home surrounded by family. ...

Abstract: The increasing heat densities in electronic components and focus on energy efficiency have motivated utilization of embedded two-phase cooling, which reduces system-level thermal resistance and pumping power. To achieve ...

Abstract: Compared to state-of-the-art heat exchangers, manifold-microchannel heat exchangers have shown superior heat removal density (kW/kg) at moderate pressure drops. However, manifold-microchannel heat exchangers made of Ni-based ...

Abstract: This paper focuses on the study of an innovative manifold microchannel design for air-side heat transfer enhancement that uses additive manufacturing (AM) technology. A numerical-based multi-objective optimization was ...

Abstract: To improve the reliability and efficiency of power electronics, their thermal management must be further enhanced. Next-generation electronics systems are predicted to dissipate more heat as die size shrinks and power ...

Abstract: Professor Avram Bar-Cohen, affectionally known to everyone as Avi, passed away on Oct. 10, 2020. Throughout his life, distressingly cut short while he remained at his peak in every respect, Avi was foremost and supremely ...