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Dielectrophoretically-Assisted Electrohydrodynamic-Driven Liquid Film Flow Boiling in the Presence and Absence of Gravity
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The ongoing development of modern electronic systems leads to smaller, more powerful devices that are expected to operate in complex environments. Due to this, advanced thermal management technologies are required to meet ...
Upstream Electrohydrodynamic Conduction Pumping for Flow Distribution Control of Parallel Microchannel Evaporators
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flow boiling in mini and microchannels has become an attractive option for many applications, such as compact and low-charge heat exchangers. Microchannel heat exchangers, however, are more susceptible to maldistribution ...
Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As modern-day electronics develop, electronic devices become smaller, more powerful, and are expected to operate in more diverse configurations. However, the thermal control systems that help these devices maintain stable ...
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