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    Multicomponent Topology Optimization for Additive Manufacturing With Build Volume and Cavity Free Constraints 

    Source: Journal of Computing and Information Science in Engineering:;2019:;volume( 019 ):;issue: 002:;page 21011
    Author(s): Zhou, Yuqing; Nomura, Tsuyoshi; Saitou, Kazuhiro
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Topology optimization for additive manufacturing has been limited to the design of single-piece components that fit within the printer's build volume. This paper presents a gradient-based multicomponent topology optimization ...
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    Multicomponent Topology Optimization for Additive Manufacturing With Build Volume and Cavity Free Constraints 

    Source: Journal of Computing and Information Science in Engineering:;2019:;volume( 019 ):;issue: 002:;page 21011
    Author(s): Zhou, Yuqing; Nomura, Tsuyoshi; Saitou, Kazuhiro
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: Topology optimization for additive manufacturing has been limited to the design of single-piece components that fit within the printer's build volume. This paper presents a gradient-based multicomponent topology optimization ...
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    Thermal Performance Optimization in Electric Vehicle Power Trains by Locally Orthotropic Surface Layer Design 

    Source: Journal of Mechanical Design:;2018:;volume( 140 ):;issue: 011:;page 111413
    Author(s): Petrovic, Mario; Nomura, Tsuyoshi; Yamada, Takayuki; Izui, Kazuhiro; Nishiwaki, Shinji
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, the application of orthotropic material orientation optimization for controlling heat flow in electric car power trains is presented. The design process is applied to a case model, which conducts heat while ...
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    Thermal Metamaterials for Heat Flow Control in Electronics 

    Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 001:;page 10904
    Author(s): Dede, Ercan M.; Zhou, Feng; Schmalenberg, Paul; Nomura, Tsuyoshi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design ...
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    DSpace software copyright © 2002-2015  DuraSpace
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