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    A Model Study of Thermal Stress-Induced Voiding in Electronic Packages 

    Source: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 004:;page 229
    Author(s): Y. Huang; K. X. Hu; N.-Y. Li; K. C. Hwang; C. P. Yeh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thin film metallizations are one of the most important interconnects in large-scale integrated circuits. They are covered by substrates and passivation films. Large hydrostatic (mean) tension ...
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    Interactive Growth of Multiple Fiber-Bridged Matrix Cracks in Unidirectional Composites 

    Source: Journal of Engineering Materials and Technology:;1996:;volume( 118 ):;issue: 003:;page 295
    Author(s): Y. Huang; N.-Y. Li; H. W. Zhang; K.-C. Hwang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A model is developed for monotonic and cyclic fiber sliding in a fiber-reinforced composite containing multiple cracks. The model is used to study the fatigue growth of multiple cracks in a ...
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