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A Model Study of Thermal Stress-Induced Voiding in Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thin film metallizations are one of the most important interconnects in large-scale integrated circuits. They are covered by substrates and passivation films. Large hydrostatic (mean) tension ...
Interactive Growth of Multiple Fiber-Bridged Matrix Cracks in Unidirectional Composites
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A model is developed for monotonic and cyclic fiber sliding in a fiber-reinforced composite containing multiple cracks. The model is used to study the fatigue growth of multiple cracks in a ...